The MicroSaw is a small, versatile diamond wheel saw, to be mounted under a standard laboratory microscope. The precision offered by such an optical alignment makes MicroSaw ideal for cutting and sectioning required during the TEM specimen preparation.

A circular diamond saw for precise cutting under stereo microscope
MicroSaw can be used under a standard stereo microscope which allows for precise positioning of specimens during cutting.

General
The compact structure and easy operation of the MicroSaw™ allows the user to reproducibly and rapidly cut almost any solid material prior to thinning for TEM. Thin pieces of ceramic materials, semiconductors, and hard metals can be further sectioned with 0.01 millimeter accuracy. Adjustment of the specimen position, arm contact point, arm tension and the downstop control mechanism is possible. Two adjustment screws at the bottom of the instrument allow positioning of the stand, providing a method for leveling the MicroSaw™ underneath the stereooptical microscope.


Features

• Precise
• Small
• Easy-to-use

Application
The system can be applied widely in the fields of materials research, geology, semiconductors and optical industry for such as multilayer systems, semiconductors, high Tc superconductors, diamond, composite materials, metals, ceramics, glasses, rocks and minerals.

Specifications
Power supply subunit

• Input voltage: 100–240 V / 50–60 Hz
• Power consumption: max. 5 W
• Dimensions: 250 mm × 150 mm × 80 mm